500g/bottle
Granularity 25-45
Melting point 217-220℃
Alloy composition Sn96.5/Ag3.0/Cu0.5
Alpha Lead Free Solder Paste OM338T
Specifications:
Alpha Lead Free Solder Paste OM338T.
Brand Alpha
Model OM338T
Alloy composition Sn96.5/Ag3.0/Cu0.5
Melting point 217-220℃
Viscosity 130 (Pa.s)
Granularity 25-45
Specification 500g/bottle
Type Lead-free solder paste
Cleaning angle No cleaning
ALPHA Electronics' high-quality ALPHA solder wire products are specially used for manual soldering, component mounting and surface assembly technology rework soldering. Suitable for all manual and machine automatic soldering, component installation and rework. High soldering ability. Very low or no corrosive flux residue. The flux core is evenly distributed. Good solderability, high solder joint strength, rosin/resin and lead-free Choose to meet the main criteria;
ALPHA solder wire offers different high-purity alloys, diameters and flux content. There are no-clean, no rosin/resin and lead-free alloys to choose from. All alloys meet the J-STD-006A standard; ALPHA's rich variety of solder wire is designed to provide excellent wettability, and the formed solder joints have high strength and no spatter. Very few flux residues are non-corrosive, and pass the SIR test to achieve defect-free soldering.
②All no-clean welding applications that need to meet Bellcore TR-TSY-00078;
① Active rosin flux;
② No cleaning;
③The residue is transparent, non-sticky and non-corrosive:
Keywords:
JUKI RS-1R Pick and Place Machine, JUKI RX-7R Pick and Place Machine, JUKI RX-8 Pick and Place Machine, JUKI RS-1R SMT Assembly Line, JUKI RX-7R SMT Assembly Line, JUKI RX-8 SMT Assembly Line.
Contact: Tommy
Phone: +86 13691605420
E-mail: sales@flason-smt.com
Add: No.94,Guangtian Road,Songgang Street,Bao an District Shenzhen China